Means of Payment
For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.
RFQ (Request for Quotations)
It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.
IMPORTANT NOTICE
1. You’ll receive an order information email in your inbox. (Please remember to check the spam folder if you didn’t hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.
Category | Parameter | Specification / Value | Notes / Conditions |
---|---|---|---|
General | Model Number | H6612 | |
Product Name | [e.g., Direct-to-Chip Liquid Cooled AI Server] | Please specify | |
Product Type | [e.g., 4U High-Performance Computing Server] | ||
Form Factor | 4U Rackmount | Optimized for liquid cooling loop integration | |
Cooling Method | Hybrid Liquid-to-Chip & Air Cooling | Key Differentiator: Advanced cooling | |
Physical | Dimensions (W x H x D) | 482.6 mm (19″) x 175.2 mm (4U) x 1100 mm | Deep chassis for radiators/pumps |
Weight | 70 kg (Max. configured, dry) | ||
Material | Cold-rolled steel | ||
Drive Bays | 8 x Hot-swappable 2.5″ NVMe Bays | All-flash for high-speed data access | |
Expansion Slots | 8 x Full-height, Full-length PCIe 5.0/6.0 Slots | Supports 8x High-End GPUs (e.g., H100/A100) | |
Power Supply | 4 x Hot-swappable 3600W (Platinum/Titanium Efficiency) | Supports 480V DC High Voltage DC Input | |
Liquid Cooling Manifold | Centralized, quick-disconnect connectors for CPU/GPUs | Enables easy serviceability | |
System Architecture | Processor | Dual Socket, Supports 5th Gen Intel® Xeon® or AMD EPYC™ 9005 “Turing” Series | Next-gen, high-TDP CPUs |
Memory | 32-48 x DDR5 DIMM Slots, Up to 12-18 TB Capacity | Massive memory for in-memory computing | |
Liquid Cooling Blocks | Standard for CPUs and GPUs, Optional for NVMe/VRM | ||
Network Controller | Dual-port 100G/200G OCP 3.0 NIC (On-board) | Eliminates network bottleneck | |
BMC | Redfish-compliant with liquid cooling telemetry | ||
I/O & Connectivity | Front Panel | 2 x USB 3.2, System Status LCD, Power Button | |
Rear Panel | 2 x QSFP-DD/OSFP (200G), 2 x USB 3.2, 1 x VGA, 1 x Management LAN | ||
Cooling Ports | 2 x Coolant Inlet/Outlet (Quick-Disconnect) | For connection to external cooling distribution unit (CDU) | |
Software & Management | Compatible OS | All major enterprise OS and hypervisors | |
Cooling Management | Integrated sensors for coolant flow rate, temperature, pressure, conductivity | Monitored via BMC and Redfish API | |
Orchestration | Validated for Kubernetes & Slurm with GPU & cooling awareness | ||
Environmental | Operating Temperature (Coolant) | +15 °C to +45 °C (Coolant Inlet Temperature) | Less dependent on ambient air temperature |
Operating Humidity | 8% to 90% RH | Non-condensing | |
Power Consumption (Max) | 10,000W – 15,000W+ | Enabled by liquid cooling | |
Acoustic Noise | < 45 dBA | Key Benefit: Near-silent operation | |
Power Usage Effectiveness (PUE) | Can achieve < 1.1 at the rack level | Key Benefit: Extreme energy efficiency | |
Certifications & Compliance | Safety | IEC/EN/UL 62368-1, with liquid cooling annex | |
EMC | FCC Part 15 Class A, CE | ||
RoHS & REACH | Compliant |
Shipping Method
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery Time
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries’ logistic time.
Mon–Fri 8:00 AM–05:00 PM
Sat–Sun Closed