S12362-121

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IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Product Technical Specification Sheet

Model: S12362-121
Product Name: UltraSens™-HD sCMOS Imaging Sensor
Revision: B.1

Category	Parameter	Specification	Notes / Conditions
Core Sensor	Sensor Type	Scientific CMOS (sCMOS)	Back-illuminated (BSI) pixel architecture
	Active Pixels	4096 (H) × 4096 (V)	16.8 Megapixels
	Optical Format	35 mm Full-Frame
	Pixel Size	4.5 µm × 4.5 µm
	Color / Mono	Monochrome	Option: RGB Color Filter Array (S12362-121C)
Performance	Readout Noise	0.7 e⁻ (typical)	Rolling Shutter, High Gain Mode
		1.2 e⁻ (typical)	Global Shutter, Low Gain Mode
	Full Well Capacity	50,000 e⁻
	Dynamic Range	> 89 dB	Dual Amplifier Architecture
	Quantum Efficiency (QE)	> 95%	@ 560 nm (Mono version, due to BSI)
	Maximum Frame Rate	25 fps	Full resolution (4096 × 4096)
		120 fps	4096 × 1024 region of interest (ROI)
	Dark Current	0.5 e⁻/pixel/s	@ +25°C (typical), with TEC cooling available
Shuttering	Shutter Type	Rolling & Global Shutter	Programmable
	Exposure Time	1 µs (min) to 60 s (max)
Electrical & Interface	Data Interface	CoaXPress 2.0 (Quad-link) / Camera Link Full	Configurable at build
	Bit Depth	16-bit
	Power Supply	+12 VDC ±5%
	Power Consumption	4.5 W (Typical)	@ full frame rate
	I/O Connector	10-pin Hirose HR10A	For trigger, strobe, GPIO
Environmental & Reliability	Operating Temperature	-10°C to +50°C	Integrated TEC option for low-noise apps
	Storage Temperature	-40°C to +85°C
	Package	Ceramic PGA	Pin Grid Array for enhanced thermal management
	MTBF (Mean Time Between Failures)	> 120,000 hours	Calculated per MIL-HDBK-217F
Physical	Die Size	18.4 mm × 18.4 mm
	Package Size	35.0 mm × 35.0 mm