sales@emi-ic.com

H6612

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You’ll receive an order information email in your inbox. (Please remember to check the spam folder if you didn’t hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Product Specification: H6612

CategoryParameterSpecification / ValueNotes / Conditions
GeneralModel NumberH6612
Product Name[e.g., Direct-to-Chip Liquid Cooled AI Server]Please specify
Product Type[e.g., 4U High-Performance Computing Server]
Form Factor4U RackmountOptimized for liquid cooling loop integration
Cooling MethodHybrid Liquid-to-Chip & Air CoolingKey Differentiator: Advanced cooling
PhysicalDimensions (W x H x D)482.6 mm (19″) x 175.2 mm (4U) x 1100 mmDeep chassis for radiators/pumps
Weight70 kg (Max. configured, dry)
MaterialCold-rolled steel
Drive Bays8 x Hot-swappable 2.5″ NVMe BaysAll-flash for high-speed data access
Expansion Slots8 x Full-height, Full-length PCIe 5.0/6.0 SlotsSupports 8x High-End GPUs (e.g., H100/A100)
Power Supply4 x Hot-swappable 3600W (Platinum/Titanium Efficiency)Supports 480V DC High Voltage DC Input
Liquid Cooling ManifoldCentralized, quick-disconnect connectors for CPU/GPUsEnables easy serviceability
System ArchitectureProcessorDual Socket, Supports 5th Gen Intel® Xeon® or AMD EPYC™ 9005 “Turing” SeriesNext-gen, high-TDP CPUs
Memory32-48 x DDR5 DIMM Slots, Up to 12-18 TB CapacityMassive memory for in-memory computing
Liquid Cooling BlocksStandard for CPUs and GPUs, Optional for NVMe/VRM
Network ControllerDual-port 100G/200G OCP 3.0 NIC (On-board)Eliminates network bottleneck
BMCRedfish-compliant with liquid cooling telemetry
I/O & ConnectivityFront Panel2 x USB 3.2, System Status LCD, Power Button
Rear Panel2 x QSFP-DD/OSFP (200G), 2 x USB 3.2, 1 x VGA, 1 x Management LAN
Cooling Ports2 x Coolant Inlet/Outlet (Quick-Disconnect)For connection to external cooling distribution unit (CDU)
Software & ManagementCompatible OSAll major enterprise OS and hypervisors
Cooling ManagementIntegrated sensors for coolant flow rate, temperature, pressure, conductivityMonitored via BMC and Redfish API
OrchestrationValidated for Kubernetes & Slurm with GPU & cooling awareness
EnvironmentalOperating Temperature (Coolant)+15 °C to +45 °C (Coolant Inlet Temperature)Less dependent on ambient air temperature
Operating Humidity8% to 90% RHNon-condensing
Power Consumption (Max)10,000W – 15,000W+Enabled by liquid cooling
Acoustic Noise< 45 dBAKey Benefit: Near-silent operation
Power Usage Effectiveness (PUE)Can achieve < 1.1 at the rack levelKey Benefit: Extreme energy efficiency
Certifications & ComplianceSafetyIEC/EN/UL 62368-1, with liquid cooling annex
EMCFCC Part 15 Class A, CE
RoHS & REACHCompliant

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries’ logistic time.

transport

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