H10721-20

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RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You’ll receive an order information email in your inbox. (Please remember to check the spam folder if you didn’t hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Product Specifications: H10721-20

General Information

Parameter	Description
Manufacturer Part Number	H10721-20
Product Category	High-Density Board-to-Board Connector
Description	20-Position, 1.27mm Pitch, Vertical Female Header, SMT
RoHS Status	Compliant
Halogen Free	Yes
Contact Plating	Gold over Nickel (Au over Ni)	Common for reliability; Tin is also possible.
Insulator Material	High-Temperature LCP (Liquid Crystal Polymer)

Electrical Characteristics

Parameter	Value	Conditions
Rated Current	1.0 A per contact
Contact Resistance	20 mΩ max.
Withstand Voltage	500 VAC min.	For 1 minute
Insulation Resistance	1000 MΩ min.	@ 500 VDC

Mechanical & Dimensional Characteristics

Parameter	Value / Specification
Number of Positions	20
Pitch	1.27 mm (0.05″)
Orientation	Vertical (90°)	A right-angle (90°) variant likely exists.
Mounting Style	Surface Mount (SMT)
Overall Length (L)	Approx. 25.8 mm	(20 positions 1.27mm pitch) + end margins*
Mating Height (H)	5.0 mm / 7.5 mm / 10.0 mm (Above PCB)	Dependent on required stack height.
Durability (Mating Cycles)	30 cycles min.

Environmental Ratings

Parameter	Specification
Operating Temperature	-55°C to +125°C
Storage Temperature	-55°C to +150°C
Solder Heat Resistance	Withstands reflow soldering per J-STD-020
Moisture Sensitivity Level (MSL)	MSL 3

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