BGA (Ball Grid Array) is a common integrated circuit packaging technology widely used in modern electronic devices (such as CPUs, GPUs, chipset controllers, etc.). Below

In high-end electronic packaging, new energy devices, and precision manufacturing, epoxy encapsulation materials, silicone-free mold release agents, and thermally conductive epoxy adhesives have become essential

The Network Interface Card (NIC) is a core hardware component that enables computer networking, directly impacting data transfer speed, latency, and stability. Whether for home

In humanity’s quest for clean energy and advanced materials, liquid fusion is emerging as a disruptive concept. Spanning nuclear fusion, liquid metal batteries, flexible electronics, and beyond,

In fields such as medical imaging, particle physics, and LiDAR, high-sensitivity photodetectors are pivotal technologies. Among these, MPPC (Multi-Pixel Photon Counter) and SiPM (Silicon Photomultiplier) stand out as revolutionary

In today’s data centers and enterprise IT infrastructures, hardware selection directly determines system performance and stability. This article covers key components such as SSDs, CPUs,

In modern electronics and the automotive industry, the quality of connectors directly impacts device performance and reliability. Delphi Connectors are known for their high performance

A temperature of 50 degrees Celsius is equivalent to a temperature of 122 degrees Fahrenheit. The formula for converting Celsius to Fahrenheit is given by °F

In today’s era of increasingly precise electronic devices and the pursuit of efficiency in industrial manufacturing, Solder Sleeve is emerging as a core technology in