H10721-210

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IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Product Specifications: H10721-210

General Information

Parameter	Description
Manufacturer Part Number	H10721-210
Product Category	High-Density Board-to-Board Connector (Mezzanine)
Description	210-Position, 1.27mm Pitch, Vertical Female Header, SMT
RoHS Status	Compliant (Directive 2015/863/EU)
Halogen Free	Yes
Contact Plating	Gold over Nickel (Au over Ni)	Essential for reliable mating of high pin counts.
Insulator Material	High-Temperature LCP (Liquid Crystal Polymer)

Electrical Characteristics

Parameter	Value	Conditions
Rated Current	1.0 A per contact
Contact Resistance	20 mΩ max.
Withstand Voltage	500 VAC min.	For 1 minute, sea level
Insulation Resistance	1000 MΩ min.	@ 500 VDC
Current Rating (Total)	210 A (theoretical max)	Limited by PCB trace capacity and thermal management.

Mechanical & Dimensional Characteristics

Parameter	Value / Specification
Number of Positions	210
Pitch (Contact Spacing)	1.27 mm (0.05″)
Orientation	Vertical (90°)	A right-angle variant may be available.
Mounting Style	Surface Mount (SMT)	May require specialized reflow processes.
Overall Length (L)	Approx. 268.3 mm	(210 positions 1.27mm pitch) + end margins*
Mating Height (H)	5.0 mm / 7.5 mm / 10.0 mm (Above PCB)	Dependent on required stack height.
Mating Force	315 N max. (approx.)	Estimated at 1.5N per mated contact pair.
Durability (Mating Cycles)	30 cycles min.

Environmental Ratings

Parameter	Specification
Operating Temperature	-55°C to +125°C
Storage Temperature	-55°C to +150°C
Solder Heat Resistance	Withstands reflow profile per J-STD-020
Moisture Sensitivity Level (MSL)	MSL 3	Often requires baking before use after the bag is opened.

Packaging