H10721-113

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RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You’ll receive an order information email in your inbox. (Please remember to check the spam folder if you didn’t hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Product Specifications: H10721-113

General Information

Parameter	Description
Manufacturer Part Number	H10721-113
Product Category	High-Density Board-to-Board Connector
Description	113-Position, 1.27mm Pitch, Vertical Female Header, SMT
RoHS Status	Compliant (Directive 2015/863/EU)
Halogen Free	Yes
Contact Plating	Gold over Nickel (Au over Ni)	Alternatively: Matte Tin (Sn)
Insulator Material	High-Temperature LCP (Liquid Crystal Polymer)

Electrical Characteristics

Parameter	Value	Conditions
Rated Current	1.0 A per contact
Contact Resistance	20 mΩ max.
Withstand Voltage	500 VAC min.	For 1 minute, sea level
Insulation Resistance	1000 MΩ min.	@ 500 VDC

Mechanical & Dimensional Characteristics

Parameter	Value / Specification
Number of Positions	113
Pitch	1.27 mm (0.05″)
Orientation	Vertical (90°)	Common option; could be Right-Angle
Mounting Style	Surface Mount (SMT)
Overall Length (L)	Approx. 144.0 mm	(113 positions 1.27mm pitch) + end margins*
Mating Height (H)	5.0 mm / 7.5 mm (Above PCB)	Dependent on stack height requirement
Durability (Mating Cycles)	30 cycles min.

Environmental Ratings

Parameter	Specification
Operating Temperature	-55°C to +125°C
Storage Temperature	-55°C to +150°C
Solder Heat Resistance	Withstands reflow profile per J-STD-020
Moisture Sensitivity Level (MSL)	MSL 3

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